Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hybrid III-V silicon laser formed by direct bonding

Hybrid III-V silicon laser formed by direct bonding

US Patent 8620164 · Granted Dec 31, 2013

Estimated economic value: $14,080,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Superluminescent diode with integrated absorber and photodetector2025
Shallow-profile optical elements for photonics receivers2025
Silicon photonic integrated circuits on substrates with structured insulators ha2025
Multi-wavelength laser generator using ring filter2024
Optical coherent receiver on a chip2024
Embedded three-dimensional electrode capacitor2024
Multi-layer silicon photonics apparatus2024
Integrated photonic transceiver2024
III-N multichip modules and methods of fabrication2024
Silicon photonic integrated lens compatible with wafer processing2024
Active-passive photonic integrated circuit platform2022
Optical receiver employing a metasurface collection lens having concentric belts2022