Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device

Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device

US Patent 8558433 · Granted Oct 15, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Conductive bonding material, bonding member including the conductive bonding mat2024
Gold powder, production method for gold powder, and gold paste2024
Gold powder, production method for gold powder, and gold paste2024
Through-hole sealing structure2023
Through-hole sealing structure2023
Structure and method for sealing through-hole, and transfer substrate for sealin2020
Structure and method for sealing through-hole, and transfer substrate for sealin2020
Noble metal paste for bonding of semiconductor element2019
Noble metal paste for bonding of semiconductor element2019
Transfer substrate for forming metal wiring and method for forming metal wiring 2019
Package production method and package produced by the method2018
Package production method and package produced by the method2018