Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for manufacturing a power device being integrated on a semiconductor substrate, in particular having a field plate vertical structure and corresponding device

Method for manufacturing a power device being integrated on a semiconductor substrate, in particular having a field plate vertical structure and corresponding device

US Patent 8558305 · Granted Oct 15, 2013

Estimated economic value: $7,870,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for manufacturing a power device being integrated on a semiconductor subs2014
Charge-balance power device comprising columnar structures and having reduced re2013
Charge-balance power device comprising columnar structures and having reduced re2013