Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of connecting a grid array package to a printed circuit board

Method of connecting a grid array package to a printed circuit board

US Patent 8549737 · Granted Oct 8, 2013

Estimated economic value: $116,740,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for converting commerical off-the-shelf (COTS) thin small-o2016
Methods for filling holes in printed wiring boards2014
Low profile compliant leads2013
Method for manufacturing leads2012
Method for forming laminated multiple substrates2011
Method and apparatus to change solder pad size using a differential pad plating2011
Method and apparatus for compliantly connecting stack of high-density electronic2010
Methods for filling holes in printed wiring boards2010
System and method of using a compliant lead interposer2010
Apparatus and method for a segmented squeegee for stenciling2009
Method and apparatus for compliantly connecting stack of high-density electronic2009
Technique for laminating multiple substrates2009