Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-die stack package

Multi-die stack package

US Patent 8546955 · Granted Oct 1, 2013

Estimated economic value: $7,574,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hardware acceleration of machine learning designs2025
Hardware acceleration of affine transformations2025
Multi-die non-blocking crossbar switch2025
Shared depthwise convolution2024
Scalable acceleration of reentrant compute operations2024
Neural-network pooling2022
Performing consecutive mac operations on a set of data using different kernels i2022
Neural network controller2022
Linear interpolator of tabulated functions2021
Data transfers between a memory and a distributed compute array2021
Digital signal processing block2020
Memory arrangement for tensor data2019