Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated three-dimensional module heat exchanger for power electronics cooling

Integrated three-dimensional module heat exchanger for power electronics cooling

US Patent 8541875 · Granted Sep 24, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Condensers and electronic assemblies2023
Jet impingement manifolds for cooling power electronics modules2023
Evaporator stacks and electronic assemblies2023
Condensers and electronic assemblies2022
Shield devices, systems, and methods for improved measurements and detection2018
Thermal barriers for compartments2017
Fluid-cooled heat sink for use in cooling various devices2017
Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooli2015
Parallel integrated thermal management2014