Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › IC device having electromigration resistant feed line structures

IC device having electromigration resistant feed line structures

US Patent 8531030 · Granted Sep 10, 2013

Estimated economic value: $8,150,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

IC package with heat spreader2025
Electronic devices in semiconductor package cavities2025
IC package with heat spreader2024
Integrated circuit with metal stop ring outside the scribe seal2024
Method of forming brass-coated metals in flip-chip redistribution layers2024
Electronic devices in semiconductor package cavities2024
Wafer chip scale packages with visible solder fillets2023
Coated semiconductor dies2023
Interconnect for electronic device2023
Semiconductor package including undermounted die with exposed backside metal2023
Brass-coated metals in flip-chip redistribution layers2022
Interconnect for electronic device2020