Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for forming dielectric layers

Methods for forming dielectric layers

US Patent 8507389 · Granted Aug 13, 2013

Estimated economic value: $15,679,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multi-layer charge trap silicon nitride/oxynitride layer engineering with interf2016
Method of forming an aluminum oxide layer2012
Enhancing NAND flash floating gate performance2012