Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Minimum contact area wafer clamping with gas flow for rapid wafer cooling

Minimum contact area wafer clamping with gas flow for rapid wafer cooling

US Patent 8454294 · Granted Jun 4, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Accessory devices that communicate with electronic devices2023
Wall module incorporating cellular concrete in a stacking structural steel wall 2021
Temperature management in a wireless energy transfer system2020
Efficient heat removal from electronic modules2020
Cladded metal structures for dissipation of heat in a portable electronic device2020
Predictive control systems and methods2020
Stacked structural steel wall trusses2020
Constructing multi-story buildings using stacked structural steel wall trusses2020
Floor shelf for multi-story buildings using stacked structural steel wall trusse2020
Floor panel for use in multi-story buildings using stacked structural steel wall2020
Electronic device with thermal management system2020
Semiconductor substrate processing apparatus including uniformity baffles2019