Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Advanced copper bonding (ACB) with ceramic substrate technology

Advanced copper bonding (ACB) with ceramic substrate technology

US Patent 8448842 · Granted May 28, 2013

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Communication method and apparatus2025
Ceramic plate structure2016
Current-feedback instrumentation amplifiers2012
Ripple reduction loop for chopper amplifiers and chopper-stabilized amplifiers2012
Heat isolation cooking device1999