Mold system for composite molding

Assignee

• Meiki Seisakusho

Inventors

• Kenji Fukumoto (32 patents)
• Shizuo Jinno (7 patents)
• Atsushi Tsukamoto (13 patents)
• Toshiaki Hotaka (9 patents)
• Fumitaka Kondo (24 patents)
• Yasuhiro Sugihara (17 patents)
• Kazuma Hisaki (3 patents)

View full patent text on Google Patents →