Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same

Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same

US Patent 8394717 · Granted Mar 12, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus for wafer placement teaching and method for wafer placement teaching u2025
Fuel tank venting system for hybrid vehicle2022
Apparatus and method for preventing overflow of fuel from vehicle fuel tank2018
Fluid heating device and vehicle fuel system using the same2016
Fuel heating device for improving cold start performance of flex fuel vehicle2015
Fuel supply system of vehicle2014
Method and system for setting security of a portable terminal2014
Container for food packaging2013
Semiconductor package having an internal cooling system2013
Wafer level chip scale package having an enhanced heat exchange efficiency with 2012
Printed circuit board2012
Semiconductor package having an internal cooling system2012