Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Print head with reduced bonding stress and method

Print head with reduced bonding stress and method

US Patent 8388778 · Granted Mar 5, 2013

Estimated economic value: $3,690,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Earphone smartcase with audio processor2025
Pulse waveforms for ink jet printing2024
Selectively conditioning audio signals based on an audioprint of an object2024
Systems and methods for selectively attenuating a voice2024
Conditioning audio signals including overlapping voices2024
Systems and methods for emphasizing a user's name2024
Hearing aid with voice or image recognition2023
Indirect printing system and related apparatus2023
Hearing aid with voice recognition2023
Systems and methods for transmitting audio signals with varying delays2023
Material displacement2023
Pulse waveforms for ink jet printing2023