Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming an interconnect structure

Method for forming an interconnect structure

US Patent 8354341 · Granted Jan 15, 2013

Estimated economic value: $414,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Antimicrobial inserts for medical devices2025
Wedge amplitude-modulation probe card and a main body thereof2025
Object display method and electronic device2025
Probe card for testing power devices under high temperature and high voltage2024
Stove2024
Semiconductor structure and fabrication method thereof2024
Photographing method and electronic device2024
Semiconductor structure formation method2024
Antimicrobial inserts for medical devices2024
Compact hyperspectral spectrometers based on semiconductor nanomembranes2024
Method for fabricating interconnection using graphene2024
Semiconductor structure and formation method thereof2023