Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Cavity closure process for at least one microelectronic device

Cavity closure process for at least one microelectronic device

US Patent 8349660 · Granted Jan 8, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Pressure sensor suited to measuring pressure in an aggressive environment2019
Electrical connectors having a bent main body for electrical connection between 2019
Method of fabricating an electromechanical structure including at least one mech2019
Method of fabricating an electromechanical structure including at least one mech2019
Multisensory detector2018
Microelectromechanical and/or nanoelectromechanical differential pressure measur2016
Encapsulation structure including a mechanically reinforced cap and with a gette2016
Gyrometer with reduced parasitic capacitances2016
Method for etching a complex pattern2015
HBAR resonator comprising a structure for amplifying the amplitude of at least o2015
Acoustic wave electromechanical device comprising a transduction region and an e2015
Electromechanical transducer device and method of forming a electromechanical tr2014