Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › BGA footprint pattern for increasing number of routing channels per PCB layer

BGA footprint pattern for increasing number of routing channels per PCB layer

US Patent 8273994 · Granted Sep 25, 2012

Estimated economic value: $41,592,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multi-pitch ball grid array2025
Multi-pitch ball grid array2023
Apparatus, system, and method for mitigating the swiss cheese effect in high-cur2022
Orthogonal cross-connecting of printed circuit boards without a midplane board2021
Orthogonal cross-connecting of printed circuit boards without a midplane board2021
Multi-pitch ball grid array2020
Methods and apparatus for providing redundant power supply protection with power2019
Methods and apparatus for providing redundant power supply protection with power2019
Computer network switch fabric assembly2019
Computer network switch fabric assembly2019
Apparatus, system, and method for mitigating crosstalk among SerDes devices2019
Removable board with cooling system for chassis-based electronic equipment2019