Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip package

Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip package

US Patent 8252630 · Granted Aug 28, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Composition for preventing or treating renal diseases, comprising exosomes deriv2025
Pretension and tensile impact test apparatus capable of simulating full-sea-dept2025
Testing device for simulating frictional wear behaviors of threaded joint of dri2025
TAM receptor-binding fusion molecule having non-inflammatory phagocytosis induci2025
System and method of manufacturing lithium ion secondary battery2025
Method for judging a low voltage defect in a lithium secondary battery2023
Vehicle exhaust gas abatement apparatus2022
Lithium air battery2020
Lithium-air battery system using vortex tube2020
Rechargeable dual massage apparatus2019
System and method for controlling voltage at point of common coupling of wind fa2015
Cutting insert2014