Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flip-chip interconnection through chip vias

Flip-chip interconnection through chip vias

US Patent 8242665 · Granted Aug 14, 2012

Estimated economic value: $939,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ultrasound probe connected via a cable2025
High power microbeamformer ultrasound transducer probe2024
Temperature insensitive backing structure for intraluminal imaging devices2023
Connectors for ultrasound imaging system2023
Capacitive micro-machined ultrasound transducer cell2022
Diagnostic test for vaccine validation and authentication and methods of use the2021
Capacitive micromachined ultrasonic transducers with overcurrent protection2021
Capacitive micromachined ultrasonic transducers with increased lifetime2021
Methods, apparatuses, and systems for coupling a flexible transducer to a surfac2021
Ultrasonically guided biopsies in three dimensions2021
Real time dosimetry of ultrasound imaging probe2021
Ultrasound imaging system and method for image guidance procedure2021