Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of testing insulation property of wafer-level chip scale package and TEG pattern used in the method

Method of testing insulation property of wafer-level chip scale package and TEG pattern used in the method

US Patent 8237450 · Granted Aug 7, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device2015
Semiconductor device2013
Semiconductor device and method of fabricating semiconductor device2012
Controller for internal combustion engine2012
Drive control device of fuel pump2011
Manufacturing method for packaged semiconductor device2010
Semiconductor device2009
Fuel vapor treatment apparatus2008
Leak detector for fuel vapor purge system2007
Failure diagnostic apparatus for fuel vapor purge system and fuel vapor purge ap2007
Failure diagnostic apparatus for fuel vapor purge system and fuel vapor purge ap2007
Packaged semiconductor device2006