Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad

Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad

US Patent 8236690 · Granted Aug 7, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Disconnecting device2025
Open-ended type substrate receiving cassette and system thereof2023
Sublimation purification apparatus and sublimation purification method2022
Semiconductor package2022
Head lamp for an automobile2022
Rear combination lamp for an automobile2022
Rear combination lamp for an automobile2022
Head lamp for an automobile2022
Rear combination lamp for an automobile2022
Rear combination lamp for an automobile2022
Control device and method for controlling function thereof2019
Printed circuit board, semiconductor package and method of manufacturing the sam2019