Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for separating semiconductor wafer into chips

Method for separating semiconductor wafer into chips

US Patent 8236605 · Granted Aug 7, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Piezoelectric actuating apparatus2025
Force sensor2022
Force sensor having first and second circuit board arrangements2021
Force sensor2018
Micro-electromechanical system (MEMS) carrier2017
Electro-acoustic transducer2017
Electro-acoustic transducer2017
Micro-electromechanical system (MEMS) carrier2016
Process for fabricating a capacitance type tri-axial accelerometer2014
MEMS sensor capable of sensing acceleration and pressure2013
3-axis accelerometer with gap-closing capacitive electrodes2013
Process of forming simulated crustacean meat1991