Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for measuring phase boundaries of a material during machining with a machining beam using additional illumination radiation and an automated image processing algorithm, and associated device

Method for measuring phase boundaries of a material during machining with a machining beam using additional illumination radiation and an automated image processing algorithm, and associated device

US Patent 8207471 · Granted Jun 26, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Determining and regulating a focal position of a processing beam2025
EUV light source with a beam positioning device2024
Method for determining a parameter of a processing process and processing machin2024
Power semiconductor chip, method for producing a power semiconductor chip, and p2023
Laser-beam material machining2023
Monitoring a thermal cutting process2022
Laser machining nozzle for a laser machining device, and laser machining device2022
Devices and methods for monitoring, in particular for regulating, a cutting proc2022
Laser-processing head and laser-processing machine comprising same2020
Methods and apparatus for depositing a metal layer on a semiconductor device2020
Devices and methods for monitoring, in particular for regulating, a cutting proc2019
Determining a focus position of a high-energy beam2019