Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Optimization of metallurgical properties of a solder joint

Optimization of metallurgical properties of a solder joint

US Patent 8197612 · Granted Jun 12, 2012

Estimated economic value: $5,600,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Resist patterned redistribution wiring on copper polyimide via layer2025
Tearing security feature of printed circuit substrates2025
Infrared debond damage mitigation by copper fill pattern2025
Electronic component comprising first and second conductive traces and a void fo2025
Coolant-cooled heat sink(s) with associated ultra-violet light assembly2024
Cryptographic hardware security module with secure embedded heat pipe2024
Antimicrobial bandage with nanostructures2024
Multi chip hardware security module2024
Secure ventilation through protective flexible sensors2023
Tamper-respondent assemblies with pressure connector assemblies2023
Optical sensor system for quantitative colorimetric liquid analysis2023
Tamper-respondent assemblies with porous heat transfer element(s)2023