Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bonding structure for a terminal of a susceptor of a semiconductor device manufacturing apparatus

Bonding structure for a terminal of a susceptor of a semiconductor device manufacturing apparatus

US Patent 8193629 · Granted Jun 5, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Plated steel material and photovoltaic power generation stand2025
Wafer placement table2025
Steel welded member2025
Wafer placement table2025
Plated steel sheet2025
Hot stamped member2025
Hot stamped steel2025
Plated steel2025
Alloyed hot dip galvannealed steel sheet2025
Member for semiconductor manufacturing apparatus2025
Member for semiconductor manufacturing apparatus2025
Wafer placement table2025