Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Sub-assembly for a light-emitting device package and a light emitting diode package with features preventing encapsulant delamination

Sub-assembly for a light-emitting device package and a light emitting diode package with features preventing encapsulant delamination

US Patent 8193557 · Granted Jun 5, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for detecting presence of illness symptoms2025
System and method for detecting presence of illness symptoms2024
System and method for detecting presence of illness symptoms2022
Optical devices for controlled color mixing2014
Method for controlling color accuracy in a light-emitting semiconductor-based de2012
Light emitting device package with frame and optically transmissive element2011
Light efficient LED assembly including a shaped reflective cavity and method for2010
Lighting device package2009
Method of making optical light engines with elevated LEDs and resulting product2009
Bendable high flux LED array2005
High flux LED array2002
Light source and technique for mounting light emitting diodes1995