Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Adhesion and electromigration performance at an interface between a dielectric and metal

Adhesion and electromigration performance at an interface between a dielectric and metal

US Patent 8178436 · Granted May 15, 2012

Estimated economic value: $21,225,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit interconnect structures with graphene cap2025
Conformal low temperature hermetic dielectric diffusion barriers2025
Self-aligned contacts2025
Conformal low temperature hermetic dielectric diffusion barriers2024
Self-aligned contacts2024
Conformal low temperature hermetic dielectric diffusion barriers2023
Via contact patterning method to increase edge placement error margin2023
Self-aligned contacts2023
Conformal low temperature hermetic dielectric diffusion barriers2023
Conformal low temperature hermetic dielectric diffusion barriers2022
Via contact patterning method to increase edge placement error margin2021
Self-aligned contacts2021