Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Metallization for chip scale packages in wafer level packaging

Metallization for chip scale packages in wafer level packaging

US Patent 8163629 · Granted Apr 24, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of fabricating a semiconductor device2025
IR emitter with glass lid2024
Semiconductor device and method2023
Method and structure for sensors on glass2023
Method for fabricating resonator structure and resonator structure2022
Systems and methods using an RF circuit on isolating material2021
MEMS device and method of manufacturing a MEMS device2020
RF switch2020
Stacked die semiconductor package with electrical interposer2020
Microelectromechanical microphone2020
Field emission devices and methods of making thereof2019
MEMS device and method of manufacturing a MEMS device2019