Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Air cavity package for flip-chip

Air cavity package for flip-chip

US Patent 8153480 · Granted Apr 10, 2012

Estimated economic value: $18,441,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

UV-C water purification device2019
Light emitting device package2019
Light source assembly and method for producing the same2018
Light emitting device package2017
Method of reducing exercise-induced joint pain in non-arthritic mammals2015
Methods of packaging a semiconductor die and package formed by the methods2012
Surface treatments for contact pads used in semiconductor chip packagages and me2012
Etch method2011
Carrier for bonding a semiconductor chip onto and a method of contracting a semi2011
Air cavity package for a semiconductor die and methods of forming the air cavity2011
Electronic device and method of manufacturing thereof2010
Electronic device and method of manufacturing thereof2009