Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device with groove structure to prevent molding resin overflow over a light receiving region of a photodiode during manufacture and method for manufacturing same

Semiconductor device with groove structure to prevent molding resin overflow over a light receiving region of a photodiode during manufacture and method for manufacturing same

US Patent 8153467 · Granted Apr 10, 2012

Estimated economic value: $136,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Surface emitting laser, surface emitting laser array, electronic device, and met2025
Light-emitting element array2025
Vehicle composition for inorganic fine particle dispersion, inorganic fine parti2025
Semiconductor device2025
Light radiating device2025
Vehicular battery case2025
Semiconductor device2025
Thermostat device2025
Band for wearable electronic device2025
Generation device and generation method2025
Semiconductor device2025
Physical property measurement method, physical property measurement device, and 2025