Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Embedded scribe lane crack arrest structure for improved IC package reliability of plastic flip chip devices

Embedded scribe lane crack arrest structure for improved IC package reliability of plastic flip chip devices

US Patent 8125053 · Granted Feb 28, 2012

Estimated economic value: $5,868,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor wafer scribelane structure2025
Standalone isolation capacitor2025
Sensor assembly and refrigerant sensing system2025
Sensor assembly2025
Standalone high voltage galvanic isolation capacitors2025
High voltage isolated microelectronic device2024
Robust gas sensor for harsh environments2024
High voltage isolation barrier with electric overstress integrity2024
IC including capacitor having segmented bottom plate2024
Standalone isolation capacitor2024
High performance high voltage isolators2024
Semiconductor device packages with high angle wire bonding and non-gold bond wir2023