Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method to form an interconnect

Method to form an interconnect

US Patent 8115313 · Granted Feb 14, 2012

Estimated economic value: $21,625,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Energy dosing for additive manufacturing2024
Window unit having UV reflecting coating with high contrast ratio at large viewi2023
Energy dosing for additive manufacturing2021
Heat treatable coated article having coatings on opposite sides of glass substra2021
Window unit having UV reflecting coating with high contrast ratio at large viewi2021
IG window unit including laminated substrates for preventing bird collisions2020
Coated article for use in surveillance window or the like and method of making s2020
Coated article supporting titanium-based coating, and method of making the same2020
Inorganic multilayer stack and methods and compositions relating thereto2019
Vending machines with large area transparent touch electrode technology, and/or 2018
Transparent conductive coating for capacitive touch panel or the like2018
Transparent conductive coating for capacitive touch panel2018