Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor chip package with post electrodes

Semiconductor chip package with post electrodes

US Patent 8110911 · Granted Feb 7, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and process for fabricating the same2021
Chip-size, double side connection package and method for manufacturing the same2020
Semiconductor device and process for fabricating the same2020
Semiconductor device and process for fabricating the same2019
Chip-size, double side connection package and method for manufacturing the same2018
Semiconductor device and process for fabricating the same2018
Semiconductor device and fabrication method for same2017
LED illumination module and LED illumination apparatus2017
Semiconductor device and process for fabricating the same2017
Stacked semiconductor device and fabrication method for same2016
Semiconductor device and process for fabricating the same2015
Heat sink package and method of manufacturing2015