Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multileveled printed circuit board unit including substrate interposed between stacked bumps

Multileveled printed circuit board unit including substrate interposed between stacked bumps

US Patent 8089775 · Granted Jan 3, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Information processing apparatus, information processing method, and program2021
Control device, control method, and program2021
Lighting system and lighting apparatus2020
Illumination control method and illumination control system and illumination sys2016
Lighting control device and lighting system2016
DPF system for an engine generator2016
Lighting system2015
Illumination apparatus2014
Illumination control system2014
Filtering dispenser container2013
Brightness sensing system and illumination system using the same2013
Multileveled printed circuit board unit including substrate interposed between s2009