Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of manufacturing a semiconductor device including a superlattice strain relief layer

Method of manufacturing a semiconductor device including a superlattice strain relief layer

US Patent 8088637 · Granted Jan 3, 2012

Estimated economic value: $3,111,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Focusing optics for use with semiconductor lasers for imaging applications2025
Device and method for UV antisepsis2024
Semiconductor array imager for printing systems2023
Semiconductor array imager for printing systems2023
Plakophillin-2 gene therapy methods and compositions2023
Optical monitoring to detect corrosion of power grid components2022
Retractable reel for handling optical fiber2022
Optical monitoring to detect corrosion of power grid components2021
Pumped edge emitters with metallic coatings2019
Thin film and substrate-removed group III-nitride based devices and method2019
P-side layers for short wavelength light emitters2018
Electronic fabric2018