Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for cutting and cleaning wafers in a wire saw

Method and apparatus for cutting and cleaning wafers in a wire saw

US Patent 8065995 · Granted Nov 29, 2011

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

HVAC controller and a method for testing HVAC systems2025
Feedthroughs2024
Armor component2019
Armor component2017
Composite slurries of nano silicon carbide and alumina2015
Abrasive particles comprising nano-sized silicon carbide particles surface-coate2014
Polishing of sapphire with composite slurries2014
In-situ wafer processing system and method2012
In-situ wafer processing system and method2012
Abrasive grain powder2011
Aqueous fluid compositions for abrasive slurries, methods of production, and met2010