Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods and systems for laser machining a substrate

Methods and systems for laser machining a substrate

US Patent 8048774 · Granted Nov 1, 2011

Estimated economic value: $1,627,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and system for processing image data2021
Method and system for calibrating imaging system2021
3D point clouds2018
Processing survey data of an underwater scene2018
Relation to underwater imaging for underwater surveys2018
Gathering range and dimensional information for underwater surveys2018
Increasing die strength by etching during or after dicing2016
Dicing a semiconductor wafer2013
Die bonding2011
Laser machining system and method2011
Program-controlled dicing of a substrate using a pulsed laser2010
Machine vision2006