Sensing chip

Assignee

• Rohm Co.
• Tsinghua University

Inventors

• Huang Yi Dong (2 patents)
• Rao Yi (1 patents)
• Liu Fang (2 patents)
• Zhang Wei (1 patents)
• Peng Jiang De (1 patents)
• Dai Ohnishi (21 patents)
• Daisuke Niwa (10 patents)
• Atsushi Tazuke (3 patents)
• Yoshikatsu Miura (15 patents)

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