Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of fabricating a stacked type chip package structure and a stacked type package structure

Method of fabricating a stacked type chip package structure and a stacked type package structure

US Patent 8012800 · Granted Sep 6, 2011

Estimated economic value: $915,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for beamforming wth automatic amplitude and phase error calibr2018
Vehicle mounted satellite antenna system with in-motion tracking using beam form2008
Wireless communication system using a plurality of antenna elements with adaptiv2007
Method and apparatus for GPS signal receiving that employs a frequency-division-2004