Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flexible diode package and method of manufacturing

Flexible diode package and method of manufacturing

US Patent 8003446 · Granted Aug 23, 2011

Estimated economic value: $8,212,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Silicon carbide semiconductor2013
Less expensive high power plastic surface mount package2012
High voltage high package pressure semiconductor package2012
Integrated circuit with flexible planer leads2011
Integrated circuit with flexible planar leads2011
Plastic surface mount large area power device2010
High temperature, high voltage SiC void-less electronic package2008
Battery cell bypass with pre-loaded compression action2001
Packaging technology for Schottky die1999
Surface mount package with low coefficient of thermal expansion1998