Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heat-conductive dielectric polymer material and heat dissipation substrate containing the same

Heat-conductive dielectric polymer material and heat dissipation substrate containing the same

US Patent 8003216 · Granted Aug 23, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Over-current protection device2025
Circuit board structure and display device2025
Over-current protection device2025
Over-current protection device2025
Over-current protection device2025
Over-current protection device2024
Vaporizing apparatus and vaporizer thereof2023
Over-current protection device2023
Over-current protection device2023
Protection device and circuit protection apparatus containing the same2021
Protection device2021
Over-current protection device2021