Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method of electrolytic removal of metals from a wafer surface

Apparatus and method of electrolytic removal of metals from a wafer surface

US Patent 7993498 · Granted Aug 9, 2011

Estimated economic value: $2,733,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Formation of trench silicide source or drain contacts without gate damage2025
Porous nanostructured electrodes for detection of neurotransmitters2025
Stress biomarker and health indicator system2025
Three-dimensional silicon-based comb probe with optimized biocompatible dimensio2024
Nanostructure featuring nano-topography with optimized electrical and biochemica2024
Porous nanostructured electrodes for detection of neurotransmitters2023
Prevention of biofilm formation2023
Prevention of biofilm formation2023
Nanostructure featuring nano-topography with optimized electrical and biochemica2023
Cranial access device2023
Cognitive optogenetics probe and analysis2022
Laminated magnetic inductor stack with high frequency peak quality factor2022