Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flexible multilayer printed circuit assembly with reduced EMI emissions

Flexible multilayer printed circuit assembly with reduced EMI emissions

US Patent 7977582 · Granted Jul 12, 2011

Estimated economic value: $4,098,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Enhanced resolution time-domain reflectometry2025
Computer system test parallelization2025
Tearing security feature of printed circuit substrates2025
Field-adjustable flex circuit transmission line filters2025
Spray foam electromagnetic interference absorber2025
Intelligent advanced engine braking system2025
Intelligent advanced engine braking system2025
Modified internal clearance(s) at connector pin aperture(s) of a circuit board2025
Electronic component comprising first and second conductive traces and a void fo2025
Ball grid array current meter with a current sense wire2024
Ball grid array current meter with a current sense wire2024
Apparatus and method for tin whisker isolation and detection2024