Glass cap molding package, manufacturing method thereof and camera module

Assignee

• Samsung

Inventors

• Jin Mun Ryu (8 patents)
• Jung Seok Lee (54 patents)
• Hyung Kyu Park (6 patents)
• Bo Kyoung Kim (8 patents)
• Yun Seok Woo (10 patents)
• Jung Jin Kim (65 patents)

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