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Home › Method for cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel

Method for cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel

US Patent 7957137 · Granted Jun 7, 2011

Estimated economic value: $16,749,000 ⓘ

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