Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

US Patent 7952442 · Granted May 31, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus and method for adaptive autonomous driving control2025
SRAM cell configured to perform multiply-accumulate (MAC) operation on multi-bit2025
Power supply apparatus for self-powered device and operation method thereof2025
Device and method for signal synthesis compensating the frequency offset of open2025
Signal synthesis apparatus and method capable of correcting frequency offset of 2025
Bearing and steering apparatus having the same2025
Lithium secondary battery2025
Computing in memory electronic device capable of supporting current based analog2025
Scalable analog PIM module, method of controlling analog PIM, signal processing 2024
Artificial intelligence algorithm-based wireless charging system capable of high2024
Biosignal processing apparatus based on intelligent control2024
Stopper and driver for steering apparatus having the same2024