Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Topping cycle for a sub-ambient cooling system

Topping cycle for a sub-ambient cooling system

US Patent 7921655 · Granted Apr 12, 2011

Estimated economic value: $6,427,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Eliminating interconnect strains in microcircuits2023
Antenna element spacing for a dual frequency electronically scanned array and re2020
Integration of ultrasonic additive manufactured thermal structures in brazements2020
Internal cavity support methodology for ultrasonic additive manufacturing2020
Additively manufactured structures for gradient thermal conductivity2020
Electronically scanned array using manifolds2019
Dual frequency electronically scanned array and related techniques2019
Wide-band high speed communications channel for cryogenic applications2019
Blind mate connector housing and assembly2019
Ballistic radome with extended field of view2018
Interleaved electronically scanned arrays2017
Hydraulic card retainer2017