Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bare die package with displacement constraint

Bare die package with displacement constraint

US Patent 7888790 · Granted Feb 15, 2011

Estimated economic value: $18,725,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Socket with integrated flex connector2022
Hinge assembly2016
Hinge assembly2016
Fastening techniques for electronic devices2015
Thermoelectrically cooling electronic devices2010
Retaining heat sinks on printed circuit boards2007