Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof

Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof

US Patent 7888179 · Granted Feb 15, 2011

Estimated economic value: $7,306,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device assemblies with molded support substrates2024
Shielded fan-out packaged semiconductor device and method of manufacturing2023
Stacked semiconductor die assemblies with die substrate extensions2022
Shielded fan-out packaged semiconductor device and method of manufacturing2021
Semiconductor device including two or more chips mounted over wiring substrate2021
Semiconductor device assemblies with molded support substrates2021
Stacked semiconductor die assemblies with die substrate extensions2020
Shielded fan-out packaged semiconductor device and method of manufacturing2019
Semiconductor device assemblies with molded support substrates2019
Stacked semiconductor die assemblies with die substrate extensions2018
Semiconductor device including two or more chips mounted over wiring substrate2017
Stacked semiconductor device and fabrication method for same2016