Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stud bumps for die alignment

Stud bumps for die alignment

US Patent 7880287 · Granted Feb 1, 2011

Estimated economic value: $8,844,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device, system, and method for detecting a defect in a computer program by gener2021
Top-side cooling of RF products in air cavity composite packages2018
Apparatuses, systems, and methods for die attach coatings for semiconductor pack2017
Air cavity package including a package lid having at least one protrusion config2013
Optical module with multiple optical sources2007
Method for attaching multiple light sources to an optoelectronic module2004
Opto-electronic package for integrated sealing of optical fibers2004
Lateral varactor with staggered punch-through and method of fabrication1991
Multiple contact connector having a low insertion force1987
Ground connector for microelectronic circuit case1986
High density low profile multiple contact connector1985
High density low profile multiple contact connector1985