Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermal interface materials

Thermal interface materials

US Patent 7867609 · Granted Jan 11, 2011

Estimated economic value: $7,410,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Compositions having a matrix and encapsulated phase change materials dispersed t2022
Compositions having a matrix and encapsulated phase change materials dispersed t2021
Compositions having a matrix and encapsulated phase change materials dispersed t2019
Electronic devices assembled with heat absorbing and/or thermally insulating com2015
Electronic devices assembled with thermally insulating layers2015
Electronic devices assembled with thermally insulating layers2015
Adhesive compositions for use in die attach applications2014
Curable resin compositions useful as underfill sealants for use with low-k diele2014
Thermal interface material with epoxidized nutshell oil2014
Adhesive compositions for use in die attach applications2012
Interface materials and methods of production and use thereof2009
Thermal interface materials2007